Automotive Chipset Architect - Telematics Qualcomm
San Diego, CA

Job Description

Job Detail

Job IdE1967463Job TitleAutomotive Chipset Architect - TelematicsPost Date11/02/2018Company-DivisionQualcomm Technologies, Inc.-CDMA Technology

Job AreaEngineering - Systems

LocationCalifornia - San Diego

Job OverviewMember of the automotive chipset architecture team contributing to the system design and implementation of automotive platforms using Qualcomm ICs and operating from San Diego with focus on Telematics.Will be responsible for Automotive based Telematics System design and use case analysis to evaluate architectural changes to existing and new platforms. Working closely with internal and external software, hardware and test teams across global sites and time zones. Responsible for documentation and presentation of analysis and results to core teams and management. Key interface to customers on "what if analysis" and implementation challenges and tradeoffs to achieve best solution. Responsible for system power grid designs for automotive devices, interface diagrams and alignment of QCOM reference designs to customer implementation.The role will involve taking high initiative and being capable of delivering quality work with little to no direction. All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.Minimum Qualifications5+ years Systems Engineering or related work experience." id="hdnMinimumQualifications" />Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.

5+ years Systems Engineering or related work experience.Preferred Qualifications10+ years of design and architecture experience with MODEM based automotive and/or mobile platforms such as smartphones, laptops or tablets.Strong analytical skills and familiarity with top-down engineering design.Capable of converting high-level product requirements to architecture trade-offs and design parameters.Experience with analysis and/or design of various power regulator topologies.Use of key performance indicators (KPI) power, cost, board area, performance, etc. and ability to trade-off design parameters against KPIs.Knowledge of current and evolving semiconductor technologies and their impact on chipset architecture.Experience with RF, PMIC and Digital product optimization to aid in chipset partitioning analysis, power distribution network analysis and architecture, or high-speed interface signal integrity/power integrity analysis and architecture.Driving complex projects across multiple teams in a leadership role.Experience with WWAN ICsExcellent communication skillsProficiency with MS Office (Excel, etc.)Familiarity with 4G/5G standards and development challenges.Knowledge of inter-chip interfaces.Experience with Infotainment and Connectivity chipsets and architectures.Experience with automotive and mobile standards.Experience with Automotive or mobile BSP and Apps software such as Android, Linux, or QNX." id="hdnPreferredQualifications" />10+ years of design and architecture experience with MODEM based automotive and/or mobile platforms such as smartphones, laptops or tablets.Strong analytical skills and familiarity with top-down engineering design.Capable of converting high-level product requirements to architecture trade-offs and design parameters.Experience with analysis and/or design of various power regulator topologies.Use of key performance indicators (KPI) power, cost, board area, performance, etc. and ability to trade-off design parameters against KPIs.Knowledge of current and evolving semiconductor technologies and their impact on chipset architecture.Experience with RF, PMIC and Digital product optimization to aid in chipset partitioning analysis, power distribution network analysis and architecture, or high-speed interface signal integrity/power integrity analysis and architecture.Driving complex projects across multiple teams in a leadership role.Experience with WWAN ICsExcellent communication skillsProficiency with MS Office (Excel, etc.)Familiarity with 4G/5G standards and development challenges.Knowledge of inter-chip interfaces.Experience with Infotainment and Connectivity chipsets and architectures.Experience with automotive and mobile standards.Experience with Automotive or mobile BSP and Apps software such as Android, Linux, or QNX.Education RequirementsPreferred: Master's, Computer Science and/or Electrical Engineering" id="hdnEducationalRequirements" />Required: Bachelor's, Computer Science and/or Electrical Engineering

Preferred: Master's, Computer Science and/or Electrical EngineeringKeywords